High-precision SiC 3D printing technology innovates aerospace and semiconductors.
RBSiC and 3D printing are merging. Through advanced polishing finishes, we create structural components that respond to extreme environments.
"IntrinSiC (R)" is an innovative technology that combines the excellent properties of reaction-bonded silicon carbide (RBSiC) with the design freedom of 3D printing. It provides precise and durable components in a short period for aerospace equipment, semiconductor devices, and defense applications. 【Features】 ■ High-precision reproduction of large and complex designs ■ Improved smoothness through precision grinding and polishing ■ Shape verification through contact and non-contact measurement ■ Support for reverse engineering *For more details, please refer to the product catalog available for download as a PDF. *Feel free to contact us with any inquiries.
- Company：シュンク・カーボン・テクノロジー・ジャパン
- Price：Other
